PCB Manufacturing Capabilities

​

With high-end and precise PCB production equipments, professional design and production personnel, a complete and strict product quality control system, authoritative third-party certification qualifications, and a stable supply chain service system, to customize the PCB products and services you need. You could quickly understand the production process of our company's PCB and the limit accuracy that the circuit board can achieve below.


1
Base Material
FR-4 ｜ High Tg ｜ Halogen-free ｜ PTFE ｜ Ceramic PCB ｜ Polyimide
2
PCB Type
PCB ｜ FPC ｜ R-FPC ｜ HDI
3
Max Layer
64 Layers
4
Min Copper
1/3 OZ （ 12um ）
5
Max Copper
12 OZ
6
Min Width/Trace（Inner layer）
2/2mil （H/H OZ base copper）
7
Max processing size
609*889mm
8
Min Width/Trace（Outer layer）
2/2mil （1/3 OZ base copper）
9
Min trace of hole to inner
6mil
10
Min trace of hole to outer
6mil
11
Min Via Soldering Ring
3mil
12
Min Component Soldring Ring
5mil
13
Min BGA Pad
8mil
14
Min BGA Pitch
0.4mm
15

Min Finished Hole Diameter(CNC/ Laster)

0.15mm（CNC）｜0.1mm（Laser）
16
Max PCB Thick to Hole Diameter
20:1
17
Min Solder Bridge Width
3mil
18
Solder Mask processing 
Film｜Laser
19
Min Insalution Thickness
2mil
20
HDI and Speical Boards
HDI（1-7 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-20 layers）
21
Surface Finish
Immersion Gold｜Pb-free tin spray｜OSP｜Immersion tin｜Immersion silver｜Hard gold plating｜Silver plating｜Immersion gold+OSP

Align the negative film with the substrate on which the dry film has been pressed, and transfer the pattern of the negative film to the photosensitive dry film by irradiating with ultraviolet light on the exposure machine.

Etching

After the unexposed dry film/wet film is removed by the developer, the copper surface will be exposed, and the exposed copper surface will be dissolved and corroded with acid copper chloride to obtain the required circuits.

Exposure

Through holes are generated between the layers of the circuit board to achieve the purpose of connecting the layers.

​Holes Drilling