PCB Assembly PCBA

How do we solder and assemble the SMD and through-hole

components on the PCB after the PCB fabrication?

This chart on the right shows you clearly how we will assemble them of both processing.

PCB SMT+DIP Assembly

Oven

Production Lines and Equipments

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High-speed SMT machines,Reflow oven,AOI,X-ray,Wave soldering.

第一

主标题

Use high-speed and high-precision visual processing technology to automatically detect various placement errors and soldering defects on the PCB.

AOI(Automated Optical Inspection)

Juki High-speed SMT machine

Component size 0201*～□74㎜, also can correspond to 50×150㎜. The maximum height of the component can correspond to 25㎜.JUKI's unique laser and visual recognition technology enables high-speed, high-precision parts recognition.

Reflow oven for SMT, wave oven for DIP. To melt the soldering paste and fix the components on the PCB through the high temperature.

It mainly uses X-rays to penetrate the PCB board, obtain images on a dedicated image sensor, and realize the perspective projection of the circuit board, so as to intuitively judge whether the quality of the product is qualified from the image.

X-ray