HDI PCB
High Density Interconnector.It is produced by micro-blind and buried via technology, a high-density PCB board with a relatively high line distribution density, so HDI boards are also called blind and buried via boards or blind and buried via circuit boards. HDI boards are widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics and other digital products.
Multi-domain PCBs include 5G communication, aerospace, large-scale servers, military industry, smart medical, industrial IoT PCBs, etc.
Multi-layer PCB
Multilayer PCBs are 4-10-layer PCBs, which are mostly used for artificial intelligence and 5G communication.
The optical module circuit board is applied to the circuit board in the optical module equipment in the field of optical fiber communication.
The flexible PCB and the rigid PCB are combined according to the relevant process requirements through the production and manufacturing processes such as lamination to form a circuit board with FPC characteristics and PCB characteristics.
Special PCB
High-frequency high-speed PCB is a kind of PCB board with high-frequency, high-speed, high-reliability, low-latency, large-capacity, high-bandwidth and other characteristics produced by high-frequency and high-speed PCB material. It is widely used in 5G communication, military radar and other large-scale in communication equipment.
Multi-field PCB
High frequency high speed PCB
Our Projects are involved in 5G Communication, Automobile, Industy 4.0, AI, IoT, Smart Medical, Military related, CCTV, Consumer Electronics, etc.
